DFT Services
Silicacore Semiconductors excels in So DFT architecture, integration, and verification services. Our design expertise adeptly interprets your specific design requirements across various stages of the SoC configuration, integration, and verification process. By accurately assessing feasibility and performance, Silicacore, translates your So concept into a viable RTL description.
Consider partnering with us at the Silicacore for a collaborative journey in bringing your product to realization. We specializen transforming your design test specification into a well-structured, testable ASIC platform using our comprehensive end-to-end DFT methodologies. These methodologies encompass Test Architecture, So DFT, Internal JAG (1687), MBIST/LBIST, Digital Scan, Analog Scan, Scan Compression, Low-power Scan, Boundary Scan, ATPG, DFT Validation, and Silicon bring-up, ensuring near 100% chip coverage. Our utilization of customized automated flows streamlines the execution process, ultimately benefiting the timeline of your product. Our primary objective is to deliver ASICs with ZERO defects (DPPM) and optimized testing time, leading to cost reduction.
Notes: solution which does not involve people to come up, architecture translated to execution automatically, give engineers the actual problems to solve and not flow related issues Tool independent solutions, resources can directly concentrate on real issues and not flow related issues Advanced DFT concepts. SSN with advanced scan subsystem and clock generation units Experts in Post silicon failure analysis Understanding on high speed interfaces to enable the test time reduction. Expertise in building complex tap network architecture to enable the broadcasting and test time reduction. Interpartition transition coverage through advanced clock generation at the SOC. Expertise in ICL, custom PDL for complex test requirement, advanced coverage metrix like cellaware, bridging, small delay Advanced DFT topics for coverage improvement 'Different format Test pattern development and pre-si validation. TE Advanced boundary scan features like 1149.6 (AC-)TAG) - AC differential pad connectivity concern during 2.5D stacking defect covering technology- coverage over stacking die. IEEE1500 understanding IEEE1687 Custom algo creations, soft algo coding, BISR, BIRA based repair strategy, Advanced BAP, understanding on hardware requirement of insystem Test and insystem repairability for automotive devices, LBIST,